Qualcomm, in partnership with Thales, has unveiled the world’s first GSMA-compliant iSIM (integrated SIM) commercially deployable on the Snapdragon 8 Gen 2 mobile platform at MWC 2023. iSIM integrates directly into the device’s processor, enabling the smartphone’s main processor to function like a SIM and connect to a cellular network without the need for a traditional SIM card or eSIM (embedded SIM).
The chip maker Qualcomm has partnered with Thales to embed the iSIM technology directly into the device’s processor.
The new iSIM is fully compliant with the GSMA Remote SIM Provisioning standard and its form factor is identical to the existing SIM card or an eSIM. With iSIM, device makers can reduce build and supply chain costs and save space with the removal of SIM card slots, leading to the creation of more compact and cost-efficient smartphones and other connected devices such as wearables and tablets.
With GSMA (Global Association for the Mobile Communications industry) security certifications, iSIM promises the same high standards of cyber-protection and offers flexible connectivity offered by the latest generation of eSIMs.
“We are very pleased to see our investment in high assurance processor hardware security, in collaboration with Thales, achieving the security and functional bar required by the GSMA for Remote Provisioning UICC use case,” said Ziad Asghar, senior vice president of product management at Qualcomm Technologies. “We believe a Tamper Resistant Element integrated within the host processor can efficiently enable innovative use cases across many markets and product segments.”
The iSIM will be first made available in high-end, innovative smartphones in the consumer electronics space. Research by Kaleido Intelligence suggests that the iSIM market share will grow to 300 million by 2027, representing 19% of all eSIM shipments.
Smartphone and Wearable brands like Apple (with eSIM-only iPhone 14 models) and Samsung are pushing the adoption of eSIM in order to eliminate the use of physical SIM cards. iSIM is next in line as it eliminates the need for a separate component like eSIM and also consumes less power than eSIMs.
“iSIM increases the opportunity to proliferate cellular capability and satisfies a wider and more diverse market,” Alex Sinclair, chief technology officer at GSMA.
“Alongside the increasingly popular eSIM, the Thales 5G iSIM gives device makers and mobile operators even greater freedom to offer their customers effortless over-the-air connectivity, and more exciting and accessible product designs,” said Guillaume Lafaix, vice president of embedded products at Thales Mobile and Connectivity Solutions.
The iSIM will be first made available in high-end, innovative smartphones powered by Snapdragon 8 Gen 2 SoC.
